Tecno has introduced a new modular smartphone concept at MWC 2026, highlighting an ultra-thin base design and a magnetic attachment system for expandable hardware.
The base smartphone measures just 4.9mm thick, making it thinner than a standard pencil and slimmer than the iPhone Air. Unlike many modular concepts that start bulky, Tecno’s device maintains a slim profile before accessories are attached.
Once modules are connected, the thickness increases. However, adding the power bank module brings the device’s profile closer to that of a typical modern smartphone, which is impressive.
Tecno developed a new interconnection system that combines magnets and pin connectors. The magnets secure modules to the device, while the pin connectors handle power delivery.
Data transfer between the phone and attached modules occurs wirelessly. The system can switch between Wi-Fi, Bluetooth, and mmWave depending on the user’s location.
The concept is designed to expand with user needs. Tecno has developed 10 modules, including different camera lens options and what appears to be a dedicated gaming controller.
The company presents the device as a phone that can evolve through hardware expansion rather than software updates alone.
The concept is shown in two color options: a silver aluminum edition and a grey version. However, the device remains a concept and is not intended for commercial release.
Tecno’s magnetic attachment technology may appear in future consumer products.
