Huawei’s Next Flagship Chip Will Be The Most Powerful in The Market

Huawei’s home-grown HiSilicon chipsets have always been overshadowed by other more popular ones such as Qualcomm’s Snapdragon and Samsung’s Exynos, but it is apparently gearing up for its biggest splash yet.

According to DigiTimes, the Chinese company’s upcoming flagship chipset, Kirin 980, will be built using TSMC’s 7nm FinFET procedure. This’ll be a sizeable jump from the Kirin 970’s 10nm procedure, as it skips the conventional 8nm bridge altogether.

Furthermore, following the latest trend, the chipset will also come alongside Cambricon’s dedicated 1M Series AI chip, for more advanced developments in the one area where Huawei has failed to make a major dent yet.

Processor Cores and Potential Availability

It’ll likely be powered by Cortex-A75 cores in an octa-core setup, with a GPU which is more powerful than that in the current P20 phones. The use of the 7nm FinFET procedure will also bring space enhancements, the smaller node size also bringing further improvements in power delivery and backup times.


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The upcoming Mate 20, which will likely arrive in the second half of this year, might be the first phone to be powered by HiSilicon Kirin 980. And if the reports are true, the phone will do more than enough to differentiate itself in the power department.

Benchmarks

Leaked AnTuTu 7 benchmarks show the Mate 20 crush its closest competitor the Galaxy S9+ with a score above 356,000, while the Samsung phone fails to even cross 265,000. Throw in the potent Leica Triple camera and the phone already looks among the best we’ve seen this year.



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