At this year’s Computex in Taiwan, MediaTek officially introduced its latest chipset, the Helio M70. It’s been a while since the company announced a high-end SoC, so this was unexpected but welcome news.
It includes ARM’s latest Cortex-A77 CPU and Mali G-77 GPU. It is built on a 7nm process and MediaTek says that it is designed to power the first wave of high-end 5G phones.
The built-in 5G modem is integrated with the Helio M70, allowing all smartphones with the chipset to use the 5G standalone and non-standalone sub 6Ghz networks. It comes with support for 2G, 3G and 4G networks too of course.
We’ll have to see benchmarks to see how it compares with the likes of Snapdragon 855 and Exynos 9820.
The Helio M70’s 5G modem can manage 4.7 Gbps maximum download speeds and 2.5 Gbps maximum upload speeds, along with multi-mode support for 2G/3G/4G and dynamic power sharing that allocates 5G bandwidth for specific applications to improve modem power efficiency by 50%.
It will also be able to support 4K video encoding and decoding at 60FPS and can work with smartphone cameras with up to 80MP resolution.
The chipset will be ready to ship to manufacturers by Q3 this year. This means that smartphones with the new chipset should arrive by 2020 or by the end of 2019 at the earliest.