Taiwanese chipmaker Mediatek has gone all out in the race of producing high-end chipsets and has unveiled its most premium smartphone SoC to date. Known as the Mediatek Dimensity 1000 5G, the chipset will be taking on the likes of Snapdragon 855+ and Kirin 990 5G.
Inside, the chip houses four high-end Cortex-A77 cores and 4 Cortex A55 cores that are clocked at 2.6GHz and 2.2GHz respectively. These CPU cores are aligned using a dual cluster arrangement instead of the usual tri cluster arrangement that is typically found in other chip brands. It features the same Mali-G77 MP9 GPU that is found in the Exynos 990 but with more cores.
The chipset comes with 5G integration thanks to the built-in Helio M70 5G modem that not only saves space but is power efficient as well. Mediatek claims that the Dimensity 1000 is the world’s fastest throughput SoC with 4.7 Gbps download speed and 2.5Gbps upload speed. It is also the first SoC that will be able to support two 5G SIMs in a single device.
It has support for both standalone and non-standalone networks and multi-mode support so that it works with all mobile networks from 2G to 5G.
Additionally, it also has support for the following features:
- 80MP single camera lens and 32MP + 16MP dual camera lenses
- Multi-frame HDR video
- QHD+ displays with 90Hz screen refresh rate
- FHD+ displays with 120Hz screen refresh rate
- Video encoding of up to 4K 60FPS
- WiFi 6, Bluetooth 5.1, and Voice over New Radio (VoNR)
The East Asian market including China and other neighboring countries will get their first smartphones featuring the Mediatek Dimensity 1000 5G in Q1 2020. The Western market including the EU and the US will get the said phones in the second half of 2020.
What’s the thickness? Is it based on 10nm?
It is based on 7nm architecture.