At its 15th Anniversary Launch Conference, Xiaomi announced its first self-developed flagship mobile processor, the XRING O1, signaling the company’s entry into the high-performance system-on-chip (SoC) market. The chip is already beating the likes of Apple’s powerful A18 Pro.
The XRING O1 is manufactured using TSMC’s advanced 3nm process and features 19 billion transistors on a 109mm² die, placing it among the most advanced mobile chips available. Xiaomi founder Lei Jun stated that the chip joins the “first echelon” of global flagship processors.
The chip uses a 10-core quad-cluster architecture, consisting of:
According to benchmark data shared by Xiaomi, the XRING O1 achieved an AnTuTu score exceeding 3 million, with single-core scores over 3,000 and multi-core performance surpassing 9,500.
For graphics processing, the XRING O1 includes the Immortalis-G925 GPU with 16 cores and support for dynamic performance scaling. Xiaomi reports that the chip delivers superior power efficiency and graphical performance compared to the Apple A18 Pro, particularly under sustained workloads.
This positions the chip not only for smartphones but also for extended applications in AR/VR and wearable devices, areas where Xiaomi continues to expand.
The shift toward in-house silicon should allow Xiaomi to optimize its hardware-software integration and reduce dependency on external chipset vendors. This move follows a growing industry trend where major smartphone brands pursue custom chip development to gain more control over performance, efficiency, and innovation cycles.
Although Xiaomi has not specified which upcoming device will debut with the XRING O1, the chip is expected to power future flagship smartphones and intelligent hardware. The announcement was made alongside other product launches, including new smartphones, wearables, and electric vehicles.