TSMC is working on a new advanced chip packaging technology called CoPoS as AI chips become larger and more complex, according to industry reports.
CoPoS stands for Chip-on-Panel-on-Substrate. TrendForce reported that TSMC has branded its panel-level packaging platform as CoPoS, with industry sources pointing to possible mass production as early as 2028.
CoPoS uses a panel-level packaging process rather than the traditional wafer-based approach used in some advanced packaging methods.
TrendForce reported that panel-level packaging uses a “rectangular instead of circular” approach. The method replaces traditional silicon wafers with glass substrates to reduce edge waste and support higher chip density.
According to analyst Ming-Chi Kuo, CoPoS initially uses glass as a temporary carrier for assembling chip components. He said the final substrate uses glass sandwiched between layers of Ajinomoto Buildup Film, also known as ABF.
TSMC’s CoPoS pilot line reportedly started receiving tools in February and was expected to be completed by June, TrendForce reported, citing the Commercial Times.
The industry expects CoPoS volume production to begin between 2028 and 2029, according to the same report.
Another TrendForce report said TSMC unveiled a 310 mm by 310 mm CoPoS product line in 2025. It added that TSMC plans to set up a first mini production line at VisEra in 2026, begin small-volume trial production in 2027, and reach mass production between 2028 and 2029.
Nvidia’s future Feynman AI chip could be one of the first products to use TSMC’s CoPoS technology, according to Kuo.
Kuo said CoPoS is expected to enter mass production in the second half of 2028. He also said the technology is designed to support larger packages for AI chips.
The new packaging technology is expected to help TSMC reduce manufacturing costs and improve chip performance, especially for AI and high-performance computing products.
If CoPoS proves successful, it could strengthen TSMC’s position in advanced chip manufacturing and put pressure on rival companies to offer competing packaging technologies.