Just recently Qualcomm announced the Snapdragon 730 chipset built on an 8nm process. According to reports, a new SoC is coming soon as well. It will be a slight step up over the regular Snapdragon 730.
The specifications of an alleged Qualcomm Snapdragon 735 have been leaked and it will be built on a 7 nm chipset which means it will be more power efficient as the Snapdragon 855.
The SoC will be built on a 7 nm process which means it will have higher efficiency. It will feature a 1 + 1 + 6 core arrangement, with a high power core, a medium performance core, and 6 low-end cores.
This looks like a middle ground between the Snapdragon 855 (which features 2 + 2 + 6 core clustering) and Snapdragon 730 (2 + 6 core arrangement).
The individual cores will all be from the Kryo 400 series. One will be clocked at 2.9 GHz paired with another core clocked at 2.4 GHz and the 6 cores will be clocked at 1.8 GHz. The 1 + 1 cores seem to be Cortex-A76 based while the other 6 seem to be Cortex-A55 derivatives.
The SoC will support USB 3.1 type C Gen 1 along with UFS 2.1 and eMMC 5.1.
The SoC will feature an Adreno 620 GPU clocked at 750 MHz. In comparison, Adreno 630 on Snapdragon 845 is clocked at 710 MHz. The modem in the leaked image has 4G and 5G mentioned which hints at the presence of an integrated 5G modem. The SoC will also feature a Neural processing unit NPU220 @1 GHz.
The GPU will have support for QHD displays which means displays with up to 3360 x 1440 resolution and a better range of colors. The SoC will also have support for up to 16 GB RAM. The Spectra 150 ISP is similar to what was featured on Snapdragon 730. It will support camera sensors up to 32 MP with 4K/30fps video recording.
There is no information on when the SoC will be announced but based on the 5G modem, we are suspecting it to be introduced in the market later this year so that smartphone manufacturers can start using it soon.