Several new phones are lining up to release soon and one of them is going to be the Realme X9. The phone has just appeared in a set of live images shared by Realme CEO Madhav Sheth which show that the phone is as thin as six credit cards stacked on top of each other.
The image shows only one of the many color options the Realme X9 will come in, the “Iridescent” finish we also saw on the Realme V15 released earlier this month. We can also see the company’s slogan in the right corner, “Dare To Leap” in uppercase letters. It is clear that this paint job will be used in most of the promo images.
The bottom of the phone is a little alarming as there is no 3.5mm headphone jack to be seen anywhere. It is unlikely that it will be on the top of the phone either, as the Realme V15 does not feature a headphone jack either, and the X9 is rumored to be a rebranded V15. Other than that, a USB C port, a speaker grille, and a microphone can be seen on the bottom of the phone.
We will update this space as soon as there is more information about the smartphone.
